Resole resin binder composition

ABSTRACT

The invention relates to a resin binder composition comprising, in combination, a resole resin and a metal salt curing accelerator providing a binder composition that has an improved cure rate in electrical grade laminates without adversely affecting electrical properties. The binder composition provides low viscosity for impregnation and accelerated curing rates for advancing the impregnated substrate prior to laminating and final curing.

This is a division of application Ser. No. 634,395, filed Nov. 24, 1975,now U.S. Pat. No. 4,043,970.

BACKGROUND OF THE INVENTION

Processing speed is important, in industrial laminating and otherapplications for cost considerations and energy conservation. Inindustrial laminating, the substrate, e.g., paper, is drawn through adip tank containing a phenol-formaldehyde resole resin binder solution,then drawn continuously through a heated oven to remove most of thevolatile material and advance the resin somewhat. The faster the ratesthe more efficient the binder and process, providing great utility.

Several ways to improve processing speed are known. One is to increasethe molecular weight of the resin and the other is to use higher solidsresin. Both methods suffer because of penetration problems into thesubstrate, leading to poorer final laminate appearance and greater waterabsorption which also gives poorer electrical properties. Generally, alow viscosity resin solution and/or low molecular weight resin isdesired for substrate penetration and the molecular weight of the resinis raised during the heating step. Increasing the molecular weight inthe impregnated substrate prepreg is needed so that when the prepreglayup is cured under heat and pressure, excessive resin flow out of thelayup is not encountered.

It has now been discovered that a low viscosity binder compositioncomprising a resole resin and a metal salt curing accelerator willprovide rapid impregnation of substrates with rapid advancement duringdrying so that during lamination and curing, excessive resin flow fromthe laminate is not experienced. It has been further discovered that theparticular metal salt curing accelerators provide accelerated curingrates without adversely affecting electrical properties.

SUMMARY OF THE INVENTION

This invention is directed to binder compositions comprising a lowviscosity resole resin and a metal salt curing accelerator, said saltbeing soluble in said resole resin, having a metal ion selected from thegroup consisting of barium (Ba++), magnesium (Mg++), manganese (Mn++),chromium (Cr+++), zinc (Zn++), aluminum (Al+++), dibasic aluminumAl(OH)₂₊, cobalt (Co++) and mixtures thereof and having an organic acidsalt radical selected from the group consisting of formate, acetate,propionate, benzoate, lactate and mixtures thereof.

DETAILS OF THE INVENTION Metal Salt Accelerators

The accelerators employed in the composition of the present inventionare metal salts. By the term "salt" is meant a compound in which themetal is ionically bonded to the salt radical. It is believed that thecuring action of the metal salt resides in the metal ion. The saltradical contributes to the function of the metal ion in allowing such tobecome soluble in the composition. Hence, the salt radical is selectedsuch that the metal salt is soluble, which is defined for the purposesof the present invention as being soluble in curing concentrations inthe binder composition.

The preferred salt radicals are carboxylates of organic acids such asformic, acetic, propionic, benzoate, lactate and mixtures thereof. Thepreferred metal ions are barium (Ba++), magnesium (Mg++), manganese(Mn++), chromium (Cr+++), zinc (Zn++), aluminum (Al+++), aluminumdihydrate Al(OH)⁺ ₂ and cobalt (Co++) and mixtures thereof.

The metal salt curing accelerators are added to the low viscosity liquidresoles by conventional stirring so as to blend them into the resole toform the binder composition. The metal salt accelerator is added inamounts of from about 0.5 to 5 parts, preferably 1 to 3 parts, by weightper 100 parts of resole resin solids.

RESOLE RESINS

The phenol-formaldehyde resole resins of the present invention areprepared from a phenol selected from the group consisting of phenol,substituted phenols and substituted phenol mixtures and mixturesthereof.

The substituted phenols useful in the resins of this invention are allphenols that have at least one reactive position open in the ortho orpara position. Phenol and such substituted phenols or their mixtures canbe used. Substituted phenols include all phenols having at least oneattached radical selected from the group consisting of alkyl, aryl,cycloalkyl, alkenyl, cycloalkenyl, alkaryl, aralkyl, carbocyclic,halogen and mixtures thereof.

Examples of substituted phenols include: phenols substituted withstraight and branched chain alkyl radicals having 1 to 16 carbon atoms,e.g., cresol, isopropylphenol, 2,3-xylenol, 3,5-xylenol, 3,4-xylenol,2,6-xylenol, mono and disubstituted butyl, amyl, octyl, nonyl, decyl anddodecyl phenols; arly substituted phenols, e.g., phenyl phenol andnaphthyl phenol; cycloalkyl phenols, e.g., terphenylphenols, e.g., usinglimonene, pinene, methadiene, cyclohexyl and cyclopentyl; cycloalkenylphenols, e.g., cyclopentenyl, dicyclopentadieneyl andmethacyclopentadieneyl phenols; alkenyl phenols, e.g., allylphenol,styrene, butenylphenol, pentenyl phenol, hexenylphenol; alkaryl phenols,e.g., tolylphenol, xylylphenol, propylphenylphenol; aralkyl phenols,e.g., benzyl, phenethyl, alphamethyl, phenyethyl, indyl and cumylphenols bisphenol A, bisphenol F, halophenols, e.g., chlorophenols,bromophenols, 2,4 dichlorophenol, 2,6,dichlorophenol, etc.

The substituted phenol mixture used to make such resin is prepared byreacting phenol under Friedel-Crafts conditions with a controlledmixture of carbocyclic compounds. The mixture or carbocyclic compoundscomprises (on a 100 weight percent basis when in a form substantiallyfree of other materials);

(A) From about 10 through 40 weight percent of compounds each moleculeof which has:

(1) the indene nucleus,

(2) from 9 through 13 carbon atoms,

(3) as nuclear substituents from 0 through 4 methyl groups,

(B) From about 5 through 70 weight percent of compounds each molecule ofwhich has:

(1) the dicyclopentadiene nucleus,

(2) from about 10 through 13 carbon atoms,

(3) as nuclear substituents from 0 through 3 methyl groups,

(C) From about 15 through 65 weight percent of compounds each moleculeof which has:

(1) a phenyl group substituted by a vinylidene group,

(2) from about 8 through 13 carbon atoms,

(3) as substituents from 0 through 3 groups selected from the classconsisting of methyl and ethyl,

(D) From about 0 through 5 weight percent divinyl benzene;

(E) Provided that the sum total of all such compounds in any given suchmixture of carbocyclic compounds is always 100 weight percent.

Such substituted phenol mixtures and the resole resins preparedtherefrom can be prepared by methods disclosed in U.S. Pat. No.3,761,448.

In general to produce a resole for use in this invention, a phenol, asjust described, is neutralized under aqueous liquid phase conditions asby the addition of base (ammonium hydroxide and/or amine), and then fromabout 1.0 to 3.0 mols of formaldehyde per one mol of phenol (preferablyfrom about 1.2 to 2.0 mols formaldehyde per mol of phenol) is mixed withthe substituted phenol product (now itself a starting material). Watermay be added with the formaldehyde. Formalin is preferred as a sourcefor formaldehyde. Also, a basic catalyst material, such as ammoniumhydroxide and/or amine selected from the group consisting of primaryamines (such as ethylamine, isobutylamine, ethanol amine,cyclohexylamine, and the like); secondary amines (such as diethanolamine, piperidine, morpholine, and the like); and tertiary amines (suchas hexamethylene tetramine, triethylamine, triethanolamine, diethylcyclohexyl amine, triisobutyl amine; and the like) is introduced intothe reaction mixture. Preferred amine catalysts have molecular weightsbelow about 300 and more preferably below about 200. The amine catalystmay include hydroxyl groups which tend to promote solubility of theamine in the reaction mixture. This basic catalyst itself thus can beused to neutralize the starting substituted phenol. The pH of thisreaction mixture is maintained from (7.0 and preferably above about 7.5)but below about 8.5. This reaction mixture is then heated totemperatures of from about 60° to 100° C., for a time sufficient tosubstantially react most of the formaldehyde and thereby produce adesired resole product. Times of from about 20 to 140 minutes aretypical. Aqueous liquid phase preparation conditions are used.

It will be appreciated that the formaldehyde to phenol mol ratios hereindescribed have reference to the total amount of phenol present before areaction, including the phenol which is substituted by the carbocycliccompound mixture, as described above.

To optimize electrical properties in resoles used in this invention, itis preferred to use as a basic catalyst, when reacting such substitutedphenols with formaldehyde to make resole resins, one which is non-ionicand non-metallic in character.

The resole product produced by reacting the substituted phenol withformaldehyde as described above is one composed of methylolatedsubstituted phenol which has been methylolated by the formaldehyde to adesired methylol content and optionally advanced (e.g., the molecularweight of the methylolated substituted phenol increased) as by heatingas necessary or desirable to make a resole resin product havingmolecular weight characteristics as above indicated. As those skilled inthe art fully appreciate, the methylol content and the degree ofadvancement are readily controllable, so that one can optimize such aresole resin for use in a particular application. For purposes of thisinvention, a phenol-formaldehyde resole resin or resole can be regardedas being the reaction product of the above-described phenol andformaldehyde under the aqueous base catalyzed conditions as describedherein which product can be thermoset by heat alone without the use of acuring catalyst.

In general, such a resole product as made is a brown colored, unstable,multiphase aqueous emulsion whose viscosity depends, in any giveninstance, upon process and reactant variables, but which usually rangesfrom a syrupy liquid to a semi-solid state. Such a resole productusually separates from such aqueous phase as a brown colored materialwhose viscosity varies from a syrup to a solid.

To recover the resole resin of this invention such an emulsion isdehydrated, preferably under heat and reduced pressure, to a watercontent of from about 0.5 to 35 weight percent (based on total resoleweight). When the resulting water content is over about 2 weightpercent, there is produced a single-phased, clear dark-colored, highsolids, resole resin. In any given instance, its total solids content,(residual) water content, and viscosity depend upon the amount of phenolaldehyde product present, the mol ratio of formaldehyde to phenol,specific type and amount of methylolation catalyst, conditions andreactants used to substitute the phenol, methylolation temperature,degree of advancement, and the like.

These resoles are characteristically dark colored, one-phase, clearliquid solutions, each having a viscosity ranging from about 5 to 5000centipoises. The exact viscosity of a given varnish depends upon manychemical process and product variables. For impregnating applications,viscosities of from about 50 to 700 centipoises are preferred.

The total solids content of a given resole can be as high as about 85weight percent or even higher, and as low as about 20 weight percent oreven lower, but preferred solids contents usually fall in the range offrom about 25 to 75 weight percent. Solids are conveniently measuredusing the ASTM Test Procedure D-115-55. As those skilled in the art willappreciate the resoles of this invention can be advanced (e.g.,cross-linked as by heating to produce larger molecules) to a greaterextent without forming precipitates from the organic solvent phase thanis the case of corresponding aqueous resole products.

When used for impregnation and reinforcing purposes, the bindercompositions of this invention are useful for impregnating cellulosicpaper, asbestos paper, and other non-woven sheet structures as well aswoven fabrics (cotton, glass fibers, nylon, etc.), etc. Impregnation canbe accomplished by any convenient means, including dipping, coating,spraying, mixing, or the like. The so-impregnated material is dried tolower the volatiles content and then heated to advance the resin to theproper degree for the intended use. The binder compositions of thisinvention are useful in the preparation of laminates, such as those madefrom such impregnated sheet materials. Such laminates are used inelectrical applications as supports or as insulation for conductiveelements. The laminates are generally manufactured in a sheet or blockform which is then punched or othewise machined to provide desiredconfiguration for a particular end use.

The binder compositions of this invention are also useful in themanufacture of cloth laminates and automotive oil filters. A suitableoil filter media, for example, is prepared by impregnating with a bindercomposition of this invention, cellulosic fiber paper modified with asynthetic fiber (polyester, or the like) and having a thickness of fromabout 5 to 20 mils. Sufficient of the binder composition of thisinvention is used to obtain an impregnated sheet member having a curedresin content of about 15 to 25 percent, based on the weight of thepaper. After such paper is so impregnated, it is heated to advance theresole resin to a so-called B-stage, and then is corrugated or pleatedto form the filter element. The filter element is then assembled withthe end use filter container and heated to 250° F. to 350° F., for from5 to 20 minutes to cure the resin. When cured, the product has goodflexibility and low tendency to crack during use.

Binder Compositions

The binder composition has, in combination, a resole resin comprisingresin solids of from 20 to 85 percent, preferably 25 to 75 percent, byweight, a dissolved water content of 0.5 to 35 percent, preferably 2.0to 15 percent by weight based on said resole resins solids, said resolehaving a viscosity of from about 5 to 5000 cps preferably 50 to 700 cps,said composition having present from about 0.5 to 5 parts, preferably 1to 3 parts of a metal salt based on said resole resin solids.

The binder composition can be a solution wherein said resole resin andaccelerator are contained in a solution comprising about 20 to 98percent, preferably 25 to 75 percent by weight of resin solids, about 2to 80 percent, preferably 25 to 75 percent by weight water and about 0.5to 5 parts preferably 1 to 3 parts of a metal salt based on said resinsolids.

The binder composition can be a solution or varnish wherein said resoleresin and accelerator are contained in a solution comprising:

(A) about 20 to 85 percent by weight of resole resin solids,

(B) about 0.5 to 15 percent by weight of water,

(C) about 0.5 to 5 parts by weight accelerator per 100 parts of resoleresin solids, and

(D) the balance up to 100 percent by weight of said solution being anorganic liquid which

(1) is substantially inert to said resin and water,

(2) evaporates below about 150° C., at atmospheric pressures,

(3) is a mutual solvent for said resin, said water and said accelerator,being present in an amount sufficient to maintain a solution.

The organic liquid is a relatively volatile, inert organic solventmedium having the properties described above. While the organic liquidused has properties as indicated above, it will be appreciated that suchliquid can comprise mixtures of different organic liquids. Preferredliquids are lower alkanols (such as ethanol and methanol) and loweralkanones (such as acetone or methyl ethyl ketone). The term "lower"refers to less than 7 carbon atoms per molecule as used herein. Aromaticand aliphatic (including cycloaliphatic) hydrocarbons can also beemployed as solvents for a given resin, including benzene, toluene,xylene, naphthalene, nonane, octane, petroleum fractions, etc.Preferably, the total water content of a solution of the invention isbelow about 15 weight percent, and more preferably falls in the range offrom about 0.5 to 5 weight percent.

Those skilled in the art will appreciate that care should preferably betaken to use an organic liquid system in which the phenolic resoleresins are completely soluble as well as any water present. Adding, forexample, a ketone or an ether-ester solvent like butyl Cellosolve willgenerally improve the water tolerance (ability to dissolve water) of asolvent system.

EMBODIMENTS

The following examples are set forth to illustrate more clearly theprinciples and practices of the invention to one skilled in the art.They are not intended to be restrictive but merely to be illustrative ofthe invention. Unless otherwise stated herein, all parts and percentagesare by weight.

EXAMPLES 1 - 8

Unsubstituted phenolic resoles of lower molecular weight are cured bythe metal catalysts of this invention. The resin used was made by thefollowing procedure:

Phenol (100 parts), 50 percent formalin (95 parts) and triethylamine (4parts) were refluxed at 70° C., to a free formaldehyde of less than 4percent. The resin was then dehydrated to 80 percent solids. The resinviscosity was 660 centipoises and contained 7 percent water.

The metal salts were mixed and dissolved in the resole resin forming thebinder composition of the present invention. Several salt compounds wereevaluated to determine the effects of the cations and anions on curingsuch compositions. The various compounds were tested for their effect onpH and "dry rubber" properties and are shown in Table I. The "dryrubber" test for testing curing rates is commonly used by those skilledin the art. The composition is spread over a hot surface such as hotplate at a controlled temperature desired for drying and curing. Aspatula is used to spread and work the composition. When the compositionloses its tackiness and does not form viscous membranes on withdrawal ofthe spatula the composition is considered cured to the "dry rubber"state. The test is used to determine how many seconds to cure to a "dryrubber" state, hence, the cure rate of the composition. This isparticularly relevant to advancing and accelerating the cure of thecomposition in the impregnated substrate during drying the compositionprior to laminating. Accelerated rates are desirable to increase thedrying and curing rates of the low viscosity fast penetrating bindercompositions of the present invention.

                  TABLE I                                                         ______________________________________                                               Salts in                   Dry Rubber                                         parts/100  Salt            Time at                                            parts of   Com-            150° C. in                           Example                                                                              Resole Solids                                                                            pounds     pH   Seconds                                     ______________________________________                                        1      0          0          8.2  285                                         2      2          Cu(OAc).sub.2                                                                            7.2  284                                         3      2          Ni(OAc).sub.2                                                                            7.9  244                                         4      4          NH.sub.4 OAc                                                                             6.4  240                                         5      2          Cr(OAc).sub.3                                                                            7.6  184                                         6      2          Mg(OAc).sub.2                                                                            8.1  150                                         7      2          Al(OH).sub.2                                                                  OAc        7.4  150                                         8      2          Zn(OAc).sub.2                                                                            7.7  140                                         ______________________________________                                    

It is evident from Examples (5-8) that the metal salts of the presentinvention have an unexpected accelerating action that gives high curerates without lowering the pH materially providing stable bindercompositions.

EXAMPLE 9 Alkylated Resole-Alcohol Solution

Charge 100 parts of phenol and 0.3 part sulfuric acid to a reactionvessel and heat to 50° C. Add 30 parts of a carbocyclic compound mixturedescribed above to the phenol mixture over 30 minutes. Then add 2 partsof hexamethylene-tetramine and 2 parts of triethylamine, after which 83parts of 50 percent formalin are added. This reaction mixture is heatedat 100° C., for 75 minutes, then the mixture dehydrated under vacuumuntil the temperature rises to 60° C., at 28 inches of mercury. Add 74parts methanol to obtain a resin solution in alcohol. The solids contentwas 59 percent and the viscosity 150 centipoises.

EXAMPLES 10 - 22

The resole solution of Example 9 was formulated using a variety of metalcompounds to determine their curing effect as determined by the "dryrubber test." In each case 100 parts of the resole resin solids wereused with the indicated metal compounds.

                  TABLE II                                                        ______________________________________                                                     Metal*         Dry Rubber                                        Example      Compound       135° (sec.)                                ______________________________________                                        10           0              162                                               11           Zn(OH).sub.2   150                                               12           Tl(OAc).sub.2  137                                               13           Ni(OAc).sub.2  131                                               14           Ca(OAc).sub.2  125                                               15           Na(OAc)        117                                               16           Ba(OAc).sub.2  105                                               17           Mg(OAc).sub.2  100                                               18           Mn(OAc).sub.2   97                                               19           Cr(OAc).sub.3   88                                               20           Zn(OAc).sub.2   85                                               21           Al(OH).sub.2 (OAc)                                                                            81                                               22           Co(OAc).sub.2   75                                               ______________________________________                                         *1 part of compound per 100 parts of resole solids.                      

It is evident from the table that in those Examples (16-22), wherein thepreferred salts of the present invention are used, that the cure rate isaccelerated to the highest degree. It was found that the Zn(OH)₂compound was not soluble in the binder composition in sufficient amountsto increase the curing rate materially. This was found to be true ofsuch compounds as CuO, PbO, Pb₃ O₄, PbO₂, Pb(OAc)₄, MgO, MnO₂ andCu(OAc)₂, which were not found to be effective in curing bindercompositions.

EXAMPLES 23 - 27

The resole resin solution of Example 9 was formulated with metal salts.1 part of the metal salts listed below were added and stirred todissolve. Nine parts of methanol were added to reduce the solids to 55percent (Solution A). The metal salts used were zinc acetate, dibasicaluminum acetate, chromium acetate, calcium acetate and sodium acetate.A control containing no metal salt was included for comparison. Testlaminates were made from the solutions of (A) and 10 mil electricalgrade cotton linters paper. Seven plies of the paper were impregnated toa resin content of 56 percent with the resin solutions of (A). Theimpregnated papers were dried in an oven at 135° C. and the times notedto reach a flow of ca. 6 percent. The seven plies of dried impregnatedpaper are assembled into a deck and cured for 30 minutes at 150° C.,under a pressure of 1000 psi to form a laminate about 1/16 inch thick.The laminates were tested with the data shown in Table III. The calciumand sodium acetate containing resins cured in the same lengths of timeas the control indicating their ineffectiveness as cure accelerators.The metal salts of the present invention cured in one-third less timeshowing their effectiveness as curing accelerators. These same 3 metalsalts also had acceptable electrical properties evidenced by thedielectric constant and dissipation factor results.

                                      TABLE III                                   __________________________________________________________________________    Examples    23  24  25    26    27   28                                       __________________________________________________________________________    Metal Salt  0   zinc                                                                              aluminum                                                                            chromium                                                                            calcium                                                                            sodium                                                   acetate                                                                           acetate                                                                             acetate                                                                             acetate                                                                            acetate                                  Resin Content (wgt. %)                                                                    54  56  56    55    56   56                                       flow, %.sup.1                                                                             6   10  7     4     6    7                                        minutes at 135° C.                                                     (B-staging).sup.2                                                                         31/2                                                                              21/2                                                                              21/2  21/2  31/2 31/2                                     dry rubber at 135° C.                                                  (sec.).sup.3                                                                              162 85  81    88    125  117                                      Water absorption, %                                                           D24/23**    1.0 1.1 0.8   1.0   0.9  1.0                                      Dielectric Constant                                                           Cond. A at 10.sup.6 cps*                                                                  5.2 5.1 5.2   5.1   5.0  5.3                                      Cond. D24/23                                                                              5.4 5.4 5.3   5.5   5.5  6.0                                      Dissipation Factor                                                            Cond. A at 10.sup.6 cps*                                                                  .043                                                                              .047                                                                              .045  .047  .046 .080                                     Cond. D24/23**                                                                            .046                                                                              .053                                                                              .049  .055  .059 .122                                     Color       brown                                                                             reddish                                                                           brown dark  brown                                                                              brown                                                    brown     brown                                               __________________________________________________________________________     *cycles per second                                                            **D24/23 samples soaked in H.sub.2 O 24 hours and 23° C.               .sup.1 Flow-wgt. % of composition flowing from laminate                       .sup.2 B-staging-time in minutes before laminating                            .sup.3 dry rubber-time in seconds for composition to cure to dry rubber  

EXAMPLE 29 Alkylated Resole-Water Solution

Charge 100 parts of phenol and 0.3 part sulfuric acid to a reactor andheat to 50° C. Add 20 parts styrene to the phenol mixture over 20minutes. Then add 4 parts triethylamine and 80 parts 50 percentformalin. The reaction mixture is heated for four hours at 70° C., andthen dehydrated under vacuum to a solids of 75 percent. The viscosity is460 centipoises and it contains 7 percent water. The various cureaccelerators claimed are dissolved in this resin solution.

More dilute versions can be formulated, e.g., 36 parts of water can beadded to 100 parts of the above resin to provide 55 percent solids resinin water. The metal salt curing accelerators can be added and laminatesmade of these solutions.

What is claimed is:
 1. A laminate comprising a substrate sheet structureof fibers selected from the group consisting of cellulosic, asbestos,glass, nylon and cellulosic modified with a synthetic, impregnated andbonded with about 15 to 65 percent of a cured resole resin solidscontaining about 0.5 to 5 parts of a metal salt curing accelerator basedon 100 parts of said resole resin solids, the remainder up to 100percent by weight of said laminate being substrate, said salt beingsoluble in said resole resin, having a metal ion selected from the groupconsisting of barium (Ba++), magnesium (Mg++), manganese (Mn++),chromium (Cr+++), zinc (Zn++), aluminum (Al+++), dibasic aluminum(Al(OH)⁺ ₂), cobalt (Co++) and mixtures thereof and having an organicacid salt radical selected from the group consisting of formate,acetate, propionate, benzoate, lactate and mixtures thereof.
 2. Alaminate of claim 1 wherein said cured resole resin comprising thereaction product of formaldehyde and a phenol, said phenol selected fromthe group of phenol, substituted phenols, substituted phenol mixture andmixtures thereof in a mol ratio 1.0 to 3.0, reacted in the presence of abasic catalyst.
 3. A laminate of claim 2 wherein said substituted phenolmixture has been prepared by alkylation of phenol with a mixture ofcarbocyclic compounds under acid conditions at a temperature in therange of 25° to 200° C., whereby 10 to 80 parts by weight of the mixtureof carbocyclic compounds reacts with 100 parts by weight of phenol, saidmixture of carbocyclic compounds comprising:(A) from 10 to 40 parts byweight of compounds each molecule of which has:(1) the indene nucleus,(2) from 9 to 13 carbon atoms, (3) as nuclear substituents from 0 to 4methyl groups; (B) from 5 to 70 parts by weight of compounds eachmolecule of which has:(1) the dicyclopentadiene nucleus, (2) from 10 to13 carbon atoms, (3) as nuclear substituents from 0 to 3 methyl groups,(C) from 15 to 65 parts by weight of compounds each molecule of whichhas:(1) a phenyl group substituted by a vinylidene group, (2) from 8 to13 carbon atoms, (3) as substituents from 0 to 3 groups selected fromthe class consisting of methyl and ethyl; and (D) from 0 to 5 parts byweight of divinyl benzene.
 4. A laminate of claim 2 wherein said phenolis phenol.
 5. A laminate of claim 2 wherein said phenol is a substitutedphenol having at least one radical selected from the group consisting ofalkyl, aryl, cycloalkyl, alkenyl, cycloalkenyl, alkaryl, aralkyl,carbocyclic, halogen and mixtures thereof.
 6. A laminate of claim 2wherein said basic catalyst is selected from the group consisting ofammonium hydroxide, hexamethylene tetramine and triethylamine.
 7. Alaminate of claim 1 wherein said metal salt is zinc acetate.
 8. Alaminate of claim 1 wherein said metal salt is cobalt acetate.
 9. Alaminate of claim 1 wherein said metal salt is aluminum dihydroxyacetate.